The addition of saccharin to nickel electroplating process as an additive is useful for refining the grain size of nickel deposit on the substrate. The addition of saccharin will produce nanocrystalline nickel layer. The reduction of crystallite size will be affected to mechanical properties and corrosion resistance of substrate. In previous studies, it is known that the addition of saccharin will decreasing the crystallite size as well as increasing the hardness. In this study will be focus about the behavior of corrosion with the addition of saccharin as an additive in the process of electroplating nickel on SPCC. The electroplating of nickel process is carried out at the acidity level of 5 for 20 minutes by keeping the operating temperature stable at 50°C. The current density used at 6 A / cm2. Within the addition of saccharin will cause changes in grain size of 165 to 35 nm. The decrease of grain size will increasing corrosion resistance in SPCC. The highest corrosion resistance is found in Ni-plating with the addition of saccharin as much as
10 g / L with corrosion rate of 3.25 μA cm-2 and resistance polarization (Rp) of 5.74 kΩ cm-2. While the non-plating steel has the highest corrosion rate of 11 μA cm-2 with the lower polarization resistance of 1.15 kΩ cm-2.